WHAT IS HOT AIR LEVELING?

Hot air leveling (HAL) is a process whereby solder is applied to the exposed copper surfaces of a printed circuit board by immersing the board in molten solder and then blowing high pressure, heated air across the board as it is removed from the solder.  

Hot air leveling can be accomplished vertically or horizontally.   Avalon currently manufactures equipment only for vertical hot air leveling.   Problematic when first developed, vertical hot air leveling has been refined and improved to the point that it now produces the best solder surface required for today's PCBs.

A typical process involves a number of steps prior to and after the HAL process to obtain the best results.  Below is a list of equipment available from Avalon to perform this process. 

Avalon Avtec Precleaner      

Avalon Avtec Post Cleaner      

Avalon Avtec AV-5 Fluxer       Flux is applied to the PCB in a fluxer, which applies a minimum amount of flux to the holes and surface of  the panel.

Avalon Avtec Micro-Cleaner

Avalon Avtec W5 Core Warmer        The PCB is passed through a core-warmer to raise the temperature of the panel.   Heating the board prior to fluxing assures that even the finest via holes will receive flux.   Manufacturers not using a core warmer typically experience problems with the flux filling the via holes instead of coating the barrel.  This results in plugged holes and rejects;    

Avalon Avtec D5 Dryer     The PCB is forced air dried; 

Avalon Avtec Rinser     The PCB is rinsed; 

Avalon Avtec S5 Scrubber      The PCB is cleaned using a soft bristle brush scrubber and mild detergent to remove residue remaining  after hot air leveling;

Avalon Avtec Accumulator

Avalon Avtec 24" x 24" Max or Avalon Avtec 30" x 30 Max   Hot air leveling;

 

 Made with pride in the U.S.A.

 Avalon Manufacturing Company 1433 North Tech Blvd., Suite 104
Gilbert, AZ 85233    (480) 507-8333 Ext. 26